DEK Horizon 02i 220V Solder Paste Stencil Printer

The DEK Horizon 02i printer is an advanced printing equipment used in the electronics manufacturing industry for precise and efficient printing of solder paste onto printed circuit boards (PCBs). It offers a wide range of functionality and features that enhance printing accuracy, speed, and flexibility.

1. Solder Paste Printing: The DEK Horizon 02i printer is specifically designed for solder paste printing onto PCBs. It utilizes advanced printing technologies, such as stencil systems and squeegee mechanisms, to achieve precise and controlled deposition of solder paste onto designated areas of the PCBs.
2. High-Speed Printing: The machine is capable of high-speed operation, ensuring fast and efficient printing of solder paste. It features a high-speed printing head and a robust conveyor system, enabling quick turnaround times and improved production efficiency.
3. Fine Pitch Printing: The DEK Horizon 02i printer is capable of printing solder paste with high accuracy and repeatability, even for PCBs with fine pitch components. It offers advanced alignment and vision systems that ensure precise alignment of the stencil and PCB, resulting in accurate solder paste deposition on small pad sizes and narrow gaps.
4. Automatic Stencil Cleaning: The machine is equipped with an automatic stencil cleaning system that ensures the cleanliness and integrity of the stencil. It removes residual solder paste, preventing contamination and defects during subsequent printing cycles. The cleaning system helps maintain consistent printing quality and prolongs the stencil's lifespan.
5. Vision Systems and Alignment: The DEK Horizon 02i printer features advanced vision systems for accurate alignment and inspection. These systems enable precise alignment of the PCB and stencil, ensuring proper registration and alignment of the solder paste deposition. The vision systems can also detect and correct for any misalignment or defects, improving print quality.
6. Process Control and Traceability: The machine provides comprehensive process control and traceability features. It offers real-time monitoring and control of printing parameters, such as squeegee pressure, speed, and separation. It can record and store process data, providing traceability and enabling analysis of printing performance and quality.

The DEK Horizon 02i printer is suitable for a wide range of solder paste printing applications, including:

1. Surface Mount Technology (SMT) Assembly: It is used in the production of PCBs with surface mount components. The printer accurately deposits solder paste onto the PCB pads, ensuring proper solder connections during the subsequent component placement and reflow processes.
2. Fine Pitch Component Printing: The machine is capable of printing solder paste with high precision and accuracy, making it suitable for PCBs with fine pitch components, such as microcontrollers, ball grid arrays (BGAs), and quad flat no-leads (QFNs). It ensures reliable solder paste deposition on small pad sizes and tight component spacing.
3. Prototype and Small Batch Production: The DEK Horizon 02i printer is widely used in prototype development and small batch production. Its flexibility and fast setup time make it ideal for quick turnaround printing jobs, allowing manufacturers to validate designs and produce small quantities of 4. PCBs with high-quality solder paste printing.
4. High-Volume Production: The machine is also suitable for high-volume production environments where speed, accuracy, and reliability are crucial. Its high-speed printing capabilities and robust construction enable efficient production of large quantities of PCBs.
5. Multi-Layer PCBs: The printer can handle multi-layer PCBs, accommodating different stencil thicknesses and board heights. It ensures consistent and precise solder paste deposition across multiple layers, maintaining the integrity of complex PCB designs.

The DEK Horizon 02i printer provides advanced functionality for accurate and efficient solder paste printing. It plays a critical role in the electronics manufacturing process, ensuring reliable solder connections and high-quality PCB assembly.